Rudra Dutta, North Carolina State University, USA

Eytan Modiano, Massachusetts Institute of Technology, USA

Yi Qian, University of Nebraska-Lincoln, USA

Deep Medhi, University of Missouri-Kansas City, USA

John Doucette, University of Alberta, Canada

Dominic Schupke, Airbus Group Innovations, Munich, Germany

William Liu, Auckland University of Technology, New Zealand

Stefano Secci, UPMC, Paris, France

Ken-Ichi Sato, Nagoya University, Japan

M. Todd Gardner, Federal Aviation Administration, Kansas City, USA

James Sterbenz, University of Kansas, USA

Piet Demeester, Ghent University – iMinds, Belgium (Chair)

Prosper Chemouil, Orange Labs, France

Tibor Cinkler, Budapest University of Technology and Economics, Hungary

Roberto Clemente, Telecom Italia, Italy

Robert Doverspike, AT&T Labs, USA

Deep Medhi, University of Missouri-Kansas City, USA

Ken-ichi Sato, Nagoya University, Japan

Dominic Schupke, Airbus Group Innovations, Germany

David Tipper, University of Pittsburgh, USA

Chadi Assi, Concordia University, Canada

Egemen Çetinkaya, Missouri University of Science and Technology, USA

Prosper Chemouil, Orange Labs, France

Piotr Cholda, AGH University of Science and Technology, Poland

Tibor Cinkler, Budapest University of Technology and Economics, Hungary

Reuven Cohen, Technion, Israel

Didier Colle, iMinds - Ghent University, Belgium

Ferhat Dikbiyik, Sakarya University, Turkey

John Doucette, University of Alberta, Canada

Robert Doverspike, Entrust Bankcard - Research, USA

Lingjie Duan, Singapore University of Technology and Design (SUTD), Singapore

Alon Efrat, University of Arizona, USA

Nelson L. S. da Fonseca, State University of Campinas, Brazil

Andrea Fumagalli, UTD, USA

David Hay, The Hebrew University of Jerusalem, Israel

Bjarne Helvik, Norwegian University of Science and Technology, Norway

Pin-Han Ho, University of Waterloo, Canada

Yu-Pin Hsu, Texas A&M University, USA

Brigitte Jaumard, Concordia University, Canada

Gregory Kuperman, MIT, USA

Hyang-Won Lee, Konkuk University, Korea

Wei Li, University of Victoria, Canada

Victor Liu, Huawei, USA

William Liu, Auckland University of Technology, New Zealand

Keije Lu, University of Puerto Rico, Puerto Rico

Thomas Magedanz, TU Berlin / Fraunhofer FOKUS, Germany

Geraldo Mateus, Universidade Federal de Minas Gerais, Brazil

Michele Nogueira, Federal University of Paraná, Brazil

Deep Medhi, University of Missouri-Kansas City, USA

Radia Perlman, Intel Laboratories, USA

Mario Pickavet, Ghent University - iMinds, Belgium

Michal Pióro, Warsaw University of Technology, Poland

Byrav Ramamurthy, University of Nebraska-Lincoln, USA

Srinivasan Ramasubramanian, University of Arizona, USA

Bo Rong, Communications Research Center Canada, Canada

George Rouskas, North Carolina State University, USA

Sarah Ruepp, Technical University of Denmark, Denmark

Iraj Saniee, Bell Labs, Alcatel-Lucent, USA

Brunilde Sansò, Ecole Polytechnique de Montreal, Canada

Galen Sasaki, University of Hawaii, USA

Dominic Schupke, Airbus Group Innovations, Germany

Stefano Secci, University Pierre et Marie Curie - Paris 6, France

Gangxiang Shen, Soochow University, P.R. China

Zhihui Shu, University of Nebraska-Lincoln, USA

Krishna Sivalingam, Indian Institute of Technology Madras, India

Arun Somani, Iowa State University, USA

Alex Sprintson, Texas A&M University, USA

Suresh Subramaniam, The George Washington University, USA

Wouter Tavernier, Ghent University - iMinds, Belgium

Krishnaiyan Thulasiraman, University of Oklahoma, USA

David Tipper, University of Pittsburgh, USA

Massimo Tornatore, Politecnico di Milano, Italy

Kishor Trivedi, Duke University, USA

Krzysztof Walkowiak, Wroclaw University of Technology, Poland

Yonggang Wen, Nanyang Technological University, Singapore

Kunjie Xu, University of Pittsburgh, USA

Zhi-Li Zhang, University of Minnesota, USA

Moshe Zukerman, City University of Hong Kong, Hong Kong

Gil Zussman, Columbia University, USA

Megan Slaughter, University of Missouri-Kansas City, USA